
LTC4557EUD#TRPBF
Power management and signal interfacing for two SIM or smart cards.
Package16-WFQFN Exposed Pad
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Power management and signal interfacing for two SIM or smart cards.
Package16-WFQFN Exposed Pad

A low-power 3 V receiver IF subsystem with a mixer, gain control and I/Q demodulation.
Package20-SSOP (0.209", 5.30 mm Width)

A dual-channel RF logarithmic detector and controller for power measurement.
Package32-Lead LFCSP (5 mm × 5 mm, exposed pad)

An RF vector multiplier for amplitude and phase control applications.
Package24-Lead LFCSP (4 mm × 4 mm, exposed pad)

A balanced modulator and demodulator for precision signal processing.
Package20-Lead SOIC (Wide)

A 6.1–6.72 GHz voltage-controlled oscillator with an integrated buffer amplifier.
Package24-Lead QFN (4 mm × 4 mm, exposed pad)
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Power managementMicrocontrollersAnalog & interface
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